The HiDEC Assembly Laboratory is located in ENRC-4802 and includes approximately (need square feet for 4802) sq. ft. of space. This lab houses the most common equipment necessary to complete the final stages of the electronic packaging processes including wire bonding, soldering, and flip-chip attachment.
If you have a question about any laboratory or process available at HiDEC, please contact the manager responsible for that specific laboratory. Likewise, if you notice any equipment issues or have safety concerns, please notify the responsible laboratory manager immediately.
Laboratory Information
Primary Contact: Tom Cannon
Secondary Contact: Errol Porter
Location: ENRC-4514