Potentials
Vapor phase oven
SOLDER ASSEMBLY SOLUTION POTENTIAL FOR WIRE BONDLESS POWER MODULES
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Did you know that HiDEC has a vapor phase oven? This system provides a consistent, uniform and reliable heat transfer for high quality solder reflow. The working envelope is 455mm long, 380mm wide and 63mm high. Purchased to solder assemble of several stacks of substrates at once, the system provides a zone of vapor generated by the evaporation of an inert liquid at the desired reflow temperature. Superior to the Sikama reflow oven in any effort to move from 2D solder integration to 3D. This may prove to be a solution to those in the Power Packaging group interested in wire bondless power assemblies.
RD2 vapor phase oven: Vapor phase technology available for 3D solder assembly.
Other Potentials
- CMS-1030-C-PCB laser: Femtosecond laser ablation upgrade available for 50µm via formation in Kapton and LTCC.
- Stratus AOI: 3D scanner upgrade available for enhanced surface profilometry and inspection.