Services
Packaging Service Opportunities
Product support from ground-breaking research to demonstration and commercialization
Backend Packaging Opportunities for Academic and Industrial Users
Die attach is the process of electrically connecting an active or passive element to a substrate. Our services include attachment via solder paste through a reflow oven, solder preforms through a vacuum oven or with brazing materials in a vacuum furnace for extreme environments.
Wire bonding is the process of electrically connecting an active element to a substrate. Our service include attachment via fine wire aluminum bonding (1 to 3 mils), heavy wire aluminum bonding (5 to 20mils), fine wire gold bonding and gold ball bumping.
Encapsulation is the process of applying a dielectric gel to isolate circuitry aimed to operate at voltages that would normally arc in such close proximity in air alone.
Dicing is the process of singulating multiple substrates on one master coupon. Depending on substrate material, thickness, and saw street widths, different dicing blades are available.
Low Temperature Co-fire Ceramic (LTCC) technology incorporates multiple distinct sheets of metal- patterned, polymer-ceramic material that are then fused into a single homogenous assembly. The technology lends itself well to RF and high-frequency applications.