High Density Electronics Center

A research center with a world-wide reputation for expertise and excellence in the field of electronic integration.

Capabilities

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capabilites

HiDEC capabilities cover nearly every process needed for electronic integration fabrication and research. Center capabilities include:

 

Areas of Expertise

System integration is at the core of all HiDEC activity. Various focus areas contribute to HiDEC core efforts, including low temperature co-fired ceramic (LTCC), advanced electronic packaging, electronics on flexible substrates, power electronics packaging and power device integration, sensor integration, and the integration of energy conversion technology.

Throughout the 28+ year history of HiDEC, expertise has been developed in a number of areas, including:

  • Device and module packaging for wide bandgap power devices
  • Flexible substrate fabrication
  • Embedded passives on flexible and ridged substrates
  • Sensor integration
  • Integration of energy conversion technology