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Backend Packaging Opportunities for Academic and Industrial Users

Encapsulation is the process of applying a dielectric gel to isolate circuitry aimed to operate at voltages that would normally arc in such close proximity in air alone. Hermetic package sealing processes with solder or glass frit are used to isolate critical microelectronic circuits from the surrounding environment.

Hermetic packaging materials are usually ceramic or metal and sealed with a metal solder(typically 80/20 AuSn) or solder-glass joint. With fixturing to hold components in place, a hermetic seal between the package seal ring and the lid is achieved. Typical applications include the manufacture of military electronics, space-rated components, implantable medical devices, precision timing circuits and micro-electro-mechanical systems (MEMS).

VACUUM ENCAPSUATION SPECIFICATION

• Chamber size: 457mm²
• Vacuum range: Down to 2 Torr
• Mixer volume: 400mL

Mix ratios available: 1:1, 2:1, 3:1, 4:1 & 10:1

LID SEALING

• Hermetic package sealing
• 80Au20Sn recipe w/ <1% voiding established
• Vacuum down to 50mTorr
• Gas backfill pressure up to 40 psig
  • N₂ & Forming gas configured
  • Ar & He optional
• Operating temperature up to 450°C
• Forming gas (4 to 5% H2/N2) equipped
• Formic acid cleaning step established
• 300mm2 graphite heated working plate