Assembly Equipment

Vacuum chamber designed to create a vacuum environment while dispensing encapsulant to insure a void free coverage.

Cost: $60/hour (academic)

The Finetech Sigma 2406 die bonder micro assembly system is capable of attaching components with placement accuracy up to +/- 0.5 micron, ideal component sizes ranging from 0.30 mm x 0.30 mm to 10 mm x 10 mm. System supports a multitude of bonding technologies including thermo-compression, thermosonic, ultrasonic, vacuum soldering and sintering.

Cost: $60/hour (academic)

The Fisher Isotemp vacuum oven is used to cure epoxies, encapsulants, solders, and other materials that do not give off chemical residues. Simple design with a knob to initiate a vacuum then another knob to purge the chamber with nitrogen to bring the chamber back to atmosphere.

Cost: $3/hour (academic)

This digital micrometer controller is tied to a Micromeasure optical stage with microscope to allow the measurement of features on samples in X, Y and Z. An external camera and monitor have been added for ease of reference identification. The system provides measurements in either inches or millimeters.

Cost: $3/hour (academic)

The Bond Jet BJ935 is an ultrasonic wedge-wedge wire bonder developed for fully automated or manual processing of a wide range of substrates, chips, and other materials. Though currently configured for 12mil aluminum wire, the tool has accessories to allow for ribbon and even copper bonding.

Cost: $60/hour (academic)

The Kulicke & Soffa Industries Model 4523 wire bonder is a manual unit capable of wedge bonding. Supported wire materials include aluminum ranging in diameter from 0.7 mils to 3 mils. One mil wire (both aluminum and gold) is kept in-stock for laboratory users; other sizes can be accommodated if the user wishes to purchase the required wire and wedges/capillaries. Ribbon bonding is also possible with this tool; 3 mil x 10 mil aluminum ribbon is available.

Cost: $20/hour (academic)

The Orthodyne Model 20 is a manual bonder designed for 4 to 20mil aluminum wire. The two units in the lab are currently set up for 5mil and 12mil wire. An external camera and monitor have been added to help with bond placement. The height of the custom vacuum chuck is adjustable.

Cost: $20/hour (academic)

The Sikama 5/C has four (4) heat zones controlled both above and below the sample to allow for individual adjustment for most solder reflow applications. Nitrogen gas flow is also adjustable at each zone to ensure the sample is blanketed during the reflow process to avoid unwanted oxidation.

Cost: $10/hour plus N2 @$20/inch (academic)

The programmable vacuum furnace is routinely used to obtain void-free solder joints without the use of flux. HiDEC purchased the HT option that can heat up to 1000°C in an inert gas (4% hydrogen in nitrogen) from vacuum levels of below 50mTorr to pressures exceeding 40 psig. Parts are heated on a graphite plate with up to four temperature probes that can be placed at different sites.

Cost: $60/hour (academic)

The programmable vacuum furnace is routinely used to obtain void-free solder joints without the use of flux. This unit has a formic acid preclean cycle run at 210°C and a reflow heat limit of 450°C in an inert gas (4% hydrogen in nitrogen) from vacuum levels at 50mTorr to pressures exceeding 40 psig. Parts are heated on a graphite plate with up to four temperature probes that can be placed at different sites.

Cost: $60/hour (academic)

This analyzer combines four basic dielectric tests into one unit. The multi-function capabilities include;

1. AC Dielectric strength testing
2. DC Dielectric strength testing
3. Insulation Resistance (IR) measurement
4. Earth Continuity measurement

Cost: $15/hour (academic)