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Thick Film
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Low Temperature Co-fire Ceramic (LTCC) technology incorporates multiple distinct sheets of metal- patterned, polymer-ceramic material that are then fused into a single homogenous assembly. The technology lends itself well to RF and high-frequency applications.
150MM LTCC PROCESS LINE SPECIFICATIONS
- Via punch range: 100mm to 508mm diameter
- Registration: (94mil) 2.3876mm diameter
- Via fill range: Up to 508mm diameter
- Screen print: 150mm to 508mm
- Collation: Hand aligned
- Lamination: Isostatic only
- Co-fire: Box furnace only
200MM LTCC PROCESS LINE SPECIFICATIONS
- Via punch range: 100mm to 508mm diameter
- Registration: (94mil) 2,3876 mm diameter
- Via fill range: Up to 508mm diameter
- Screen print: 150mm to 508mm
- Collation: Vision alignment
- Heat tack or glue tack option
- Lamination: Isostatic only
- Co-fire: Box furnace only